What Can You Expect in 2026?
Advancing Data Center Cooling Innovation is the first and only forum dedicated exclusively to the evolving role of mechanical engineering in next-generation data centers. Across two content-rich days, leading hyperscalers, colocators, engineers, and contractors will unite to uncover the latest technical breakthroughs and proven strategies for delivering efficient, adaptable, and AI-ready mechanical, thermal, and water systems, including:
• Hybrid air–liquid cooling architectures enabling ultra-high-density racks and flexible deployment models• Advanced heat rejection and recovery systems reducing energy use and supporting sustainability goals
• Innovative mechanical design approaches to improve commissioning, reliability, and lifecycle performance
• Integration of mechanical and electrical systems to unlock facility-wide energy optimization
• Best practices in water stewardship and adaptive system design for diverse environmental conditions
Unmissable Sessions:
1. Accelerating Liquid Cooling Adoption
Discover how Equinix and Salute are transitioning from air to liquid cooling to meet AI-driven density demands. Explore practical strategies to scale hybrid and full-liquid systems while overcoming integration and interoperability challenges.
2. Designing for Sustainability & Resource Efficiency
Learn how TetraTech is balancing water use, energy consumption, and resilience across diverse climates. Gain insights into using non-potable water, district cooling, and integrated WUE/PUE metrics to optimize resource efficiency and meet environmental goals.
3. Engineering Cooling Systems for Efficiency & Resilience
See how JLL and Arcadis are designing low-overhead, high-performance systems that minimize lifecycle costs while ensuring uptime and scalability. Explore innovations that drive down the total cost of ownership without compromising reliability.
Featuring case studies from JLL and Arcadis
4. Enhancing Collaboration Across Design & Operations
Bridge the gap between design intent and operational performance through stronger cross-disciplinary coordination. Hear how AWS, Microsoft, NTT, JLL, and WSP are aligning mechanical and electrical systems to manage AI load swings and improve end-to-end reliability.
5. Overcoming Design Challenges of High-Density Chips
Overcoming design challenges of high-density chips requires more than just equipment upgrades; it demands a holistic approach that protects infrastructure while meeting growing demand. This session will explore how operators are designing CDUs and piping systems to handle elevated hydraulic loads, leveraging modeling and simulation to stress-test against extreme AI and HPC workloads, and optimizing heat circulation to maximize efficiency, reduce water use, and maintain effective thermal management.
Explore the Full Event Guide
- 18+ Expert Speakers from Microsoft, AWS, Equinix, Arcadis, and many more
- 3 Days of In-Depth Technical Content & Case Studies
- 4 Interactive Panels & Roundtables Driving Practical Takeaways
- 10+ Hours of Dedicated Networking & Partnership Opportunities
Attending Companies Include
Join Data Center Leaders
Join 80+ mechanical, thermal, cooling, and building performance decision-makers at the only event dedicated to advancing next-generation cooling and mechanical design for AI-ready data centers.
Explore the Agenda
Discover cutting-edge strategies in liquid cooling, energy efficiency, and system integration driving the future of sustainable, high-performing facilities.
Partner With Us
Network with leaders from hyperscalers, colocators, and design firms shaping the evolution of mechanical innovation across the US data center landscape.