Overcoming Design Challenges of High-Density Chips to Protect Infrastructure & Meet Increasing Demand
- Designing CDUs (Coolant Distribution Units) and piping systems capable of handling elevated hydraulic loads to address increasing pressure drops and fluid flow challenges
- Leveraging modeling and simulation to stress-test designs against extreme AI and HPC workloads before full-scale deployment
- Addressing constrained heat circulation rates that limit free cooling and economizer performance to maximize energy efficiency, reduce water consumption and maintain effective thermal management