Explore the Agenda

8:00 am Check-In, Networking & Light Breakfast

9:00 am Chair’s Opening Remarks

Mechanical subject matter expert, CleanArc Data Centers

Meeting High-Density Chip Demands with Scalable Design

9:10 am Fireside Chat: Discussing the Shift to Dynamic Systems to Anticipate Roadmaps & Guide Long-Term Strategy

Mechanical Engineer, NTT Global Data Centers
Mechanical CFD Engineer Senior Associate, Equinix, Inc.
  • Analyzing chip manufacturer roadmaps and emerging technologies to anticipate evolving thermal and power requirements
  • Evaluating advanced mechanical equipment innovations to balance compact footprints with energy efficiency
  • Exploring alternative piping materials and configurations beyond stainless steel to speed installation, maintain fluid purity, improve reliability and reduce material and operational costs

9:50 am Overcoming Design Challenges of High-Density Chips to Protect Infrastructure & Meet Increasing Demand

Executive Director Data Center Development and Delivery, Provident Data Centers
  • Designing CDUs (Coolant Distribution Units) and piping systems capable of handling elevated hydraulic loads to address increasing pressure drops and fluid flow challenges
  • Leveraging modeling and simulation to stress-test designs against extreme AI and HPC workloads before full-scale deployment
  • Addressing constrained heat circulation rates that limit free cooling and economizer performance to maximize energy efficiency, reduce water consumption and maintain effective thermal management

10:30 am Morning Refreshments & Networking

Scaling & Adapting Systems Efficiently

11:10 am Case Study: Utilizing Modularization & Prefabrication to Expand Cooling Technologies Across Multiple Sites & Achieve Scalable Growth

Sr. Mechanical Engineer, NTT DATA Italia
  • Identifying mechanical systems suitable for prefabrication and modularization to maximize output, achieve economies of scale and simplify deployment
  • Defining modular units of growth (e.g., racks or kW per rack) to guide decisions on whether to scale a single site or distribute workloads across multiple locations for cost efficiency
  • Modularizing backbone systems for campus-wide scalability to enable future expansions without disrupting ongoing operations and maintain consistent reliability

11:50 am Case Study: Retrofitting Existing Spaces & Equipment to Integrate Liquid Cooling

Mechanical subject matter expert, CleanArc Data Centers
  • Analyzing legacy equipment lifespan and current performance to determine the most cost-effective retrofit timing and scope
  • Optimzing space and routing within legacy systems to integrate new equipment efficiently without major structural modifications
  • Implementing phased retrofit approaches that maintain continuous operations to minimize downtime

12:30 pm Unlocking Gigawatt-Scale AI: The Modular Future of Liquid Cooling Infrastructure

Chief Executive Officer, Liquid Stack
  • Establishing liquid cooling as the foundational infrastructure for next-generation AI data centres as GPU power densities continue to rise
  • Enabling reliable, efficient scaling through repeatable 2.5 MW modular CDU building blocks that support predictable growth to 10 MW and beyond
  • Reducing risk and improving capital efficiency by deploying true modular liquid cooling that future-proofs AI infrastructure while scaling in step with demand

12:40 pm Networking Lunch Break

Staying Ahead Amid Ever-Evolving Technologies

1:40 pm Audience Discussion: Accelerating Project Delivery Amid Evolving Equipment & Supply Chain Challenges

  • Strengthening collaboration and communication with equipment suppliers to proactively identify long-lead items, anticipate delays, and adapt to rapidly evolving equipment technologies
  • Evaluating strategic bulk purchasing and pre-procurement approaches to secure competitive pricing, reduce risk, and ensure availability in an unpredictable supply chain environment
  • Identifying practical, forward-looking actions organizations can take to stay ahead of evolving equipment trends, increase resilience, and accelerate overall project delivery

1:40 pm Panel: Tracking the Latest Trends & Development Pipeline to Shape Smarter Investment & Future-Ready Strategies

Vice President - Engineering, Menlo Equities
Senior Director - Engineering & RCx Engineer, Jones Lang LaSalle
Sr Mechanical Engineer, WSP Group
  • Exploring emerging technologies, including Computational Fluid Dynamic simulation, to keep up with the latest innovation in mechanical design
  • Engaging with owners and operators to understand their roadmaps, pain points and evolving standards that will shape the next 2–5 years of infrastructure design
  • Translating end-user priorities into smarter mechanical builds to align construction and delivery with evolving customer expectations

2:20 pm Chair’s Closing Remarks

Mechanical subject matter expert, CleanArc Data Centers

3:10 pm End of Conference